Prepared Entrées and Side Dish Packaging
Mouthwatering Meals and Side Dishes Made Easy
Whether you’re packaging fresh or frozen, family-sized or single-serve, you’ll find a market-leading solution to make your meals and side dishes easier to prepare, serve and clean up with Curwood. Choose from VSP (Vacuum Skin Packaging), tray & lid or shrink-bag systems that work with oven-ready aluminum, dual-ovenable CPET or microwavable poly trays. Or, select from four innovative Bemis® Magic Steam™ self-venting styles, the industry’s most comprehensive assortment of packaging systems for microwave cooking.
Packaging for Prepared Entrées and Side Dishes
- Bemis Magic Steam Self-Venting Standup Pouch for frozen or shelf-stable entrées and side dishes
- Bemis Magic Steam Self-Venting Skin Pack for high- and low-profile entrées and side dishes
- Bemis Magic Steam Thermoform Self-Venting Package for frozen entrées and side dishes
- Bemis Magic Steam Vertical-Fill Self-Venting Package for vertical/form/fill/seal applications
- Surround® Shrink Bags for easy-open entrées and side dishes
- Standup Pouches for frozen or shelf-stable entrées and side dishes
- Tray & Lid Systems for gas-flushed entrées and side dishes
- VSP (Vacuum Skin Packaging) for entrées and side dishes
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Learn More!
- Curwood@Bemis.com or Curwood Sales: 800.544.4672
- Request Literature
Markets
- Cheese Packaging
- Coffee Packaging
- Consumer & Industrial
- Convenience Food Packaging
- Liquid Products Packaging
- Meat Packaging
- Pizza, Pasta, Bakery Packaging
Cook Up Convenience!
Bemis Magic Steam self-venting packaging preserves the taste, texture and nutrition of your pre-cooked “heat & eat” shelf-stable, refrigerated or frozen meals while saving prep, serving and cleanup time.
Have It All!
Combine VSP and lidding film to achieve powerful shelf presence, extended shelf life and value-added convenience all while eliminating the cost of gas flushing.
The Next Big Packaging Idea
As a global leader in the material science of packaging, Curwood works side by side with processors to develop materials that optimize the latest equipment technologies and capitalize on market trends.
